Semi-Automatic Two-Component Glue Filling Machine HY-S55L

Small batches, frequent product changeovers and high-filler adhesives make manual potting slow, inconsistent and wasteful.

Mixing Ratio 1:1–10:1 ±2% | Dispensing 1–30 g/s | Tanks 15/30/55 L | AC 380 V

Chat on WhatsApp: +86 18158897969

Get a Quote

Product Introduction

Home › Products › Dispensing & Potting › Semi-Automatic Two-Component Glue Filling Machine HY-S55L

For small batches, prototypes and multi-product workshops, a full inline line is overkill — yet manual mixing is slow, inconsistent and wastes expensive two-component material. The HY-S55L semi automatic potting machine bridges that gap: servo-driven metering pumps mix epoxy, polyurethane or silicone at an adjustable 1:1–10:1 ratio with ±2% accuracy, then dispense at 1–30 g/s through a handheld gun with foot-switch control.

The operator positions the workpiece and triggers each shot while the machine handles ratio, flow and anti-curing automatically. Stainless-steel 15/30/55 L tanks with stirring and visible level windows keep material ready; the optional vacuum defoaming module removes micro-bubbles for high-insulation electronics.

Running on AC 380 V in a 350 kg cabinet, this semi automatic potting machine switches products by recipe recall — the cost-effective choice for LED drivers, automotive sensors, control boards, transformers and small power modules.

Specification

Item	Semi-Automatic Two-Component Glue Filling Machine HY-S55L
Model	HY-S55L
Metering system	Servo-driven pumps, 1–4 sets; gear / screw / piston matched to material
Mixing ratio	1:1–10:1 adjustable
Ratio accuracy	±2%
Dispensing speed	1–30 g/s, adjustable
Dispensing mode	Handheld gun with foot-switch control
Mixing method	Dynamic / static, optional
Material tanks	15 / 30 / 55 L stainless steel, stirring + visible level window
Compatible materials	Epoxy, polyurethane, silicone; viscosity up to 500,000 cps
Vacuum defoaming	−98 kPa (optional module)
Anti-curing	Automatic, 0–300 s adjustable
Monitoring	Pressure, flow, liquid level, stirring; alarms with three-colour light
Power supply	AC 380 V
Air supply	0.5–0.7 MPa
Cabinet	Thickened cold-rolled steel, approx. 350 kg
Working environment	0–40 ℃

Specifications can be customised to your workpiece and material.

Features

Precise ratio, every shot — servo-driven metering pumps hold the A:B ratio at 1:1–10:1 with ±2% accuracy, so every shot cures the same.
Built for small batches — handheld gun with foot-switch control and 1–30 g/s adjustable flow adapts to multi-product workshops, prototypes and frequent changeovers.
Dynamic or static mixing — mixing valve options match the adhesive’s viscosity and pot life.
Stable material supply — 15/30/55 L stainless tanks with stirring and visible level windows, plus automatic refill.
Automatic cleaning & anti-curing — auto-clean cycle with a 0–300 s adjustable anti-curing timer protects the mixing valve between shots.
Full process monitoring — pressure, flow, level and stirring monitored continuously; the three-colour alarm light signals any anomaly.
Bubble-free option — the optional vacuum defoaming module pulls −98 kPa to remove micro-bubbles for high-insulation electronics.
Heavy-duty construction — thickened cold-rolled steel cabinet with all-stainless metering pumps, built for long service life.

Optional Configuration

Option	What it does
Metering Pump Matching	Gear, screw or piston pumps selected for the adhesive’s viscosity and ratio
Vacuum Defoaming Module	−98 kPa vacuum degassing of raw material for bubble-free potting
Material Tank Heating Function	Keeps high-viscosity adhesives at a stable dispensing temperature
Multi-Spec Material Barrel	15 / 30 / 55 L tank options matched to batch size
Handheld Boom Extension	Extends the handheld gun’s reach for large workpieces
Real-Time Monitoring System	Pressure, flow, weighing, level and stirring monitoring with alarms

Comparison

Typical property ranges from published material guides; check your compound’s TDS for exact figures.

Property	Epoxy	Polyurethane (PU)	Silicone
Cured hardness	Shore D 70–95 (rigid)	Shore A 30 – D 60 (flexible–semi-rigid)	Shore A 20–70 (elastomeric)
Continuous temperature	Up to 150–180°C	−40 to 120–130°C	−55 to 200°C
Adhesion	Excellent	Good–excellent on plastics	Moderate (primer recommended)
Thermal shock resistance	Fair (can crack)	Good	Excellent
Reworkability	Poor	Poor	Excellent (cuttable)
Relative cost	Medium	Low–medium	High
Typical automotive use	Power modules, coils needing structure	Sensors, connectors needing flex	High-temperature / high-vibration electronics
On this machine	✔	✔ (vacuum module recommended — PU traps bubbles easily)	✔

Packaging & Delivery

The semi-automatic two-component glue filling machine HY-S55L is packed in a fumigation-free export wooden case with moisture protection, fixed for sea freight. Standard machines ship in 30–45 days; customised configurations in 60–120 days depending on complexity (final schedule in contract). HY engineers provide installation, commissioning and operator training on site or by video, with process parameters set against your own parts before handover. Warranty and after-sales terms follow the sales contract; remote troubleshooting is available for overseas customers, and every machine’s potting programs and calibration data are archived by HY for lifetime support.

Core Advantages

Precise Ratio, Every Shot

Servo-driven metering pumps hold the A:B ratio at 1:1–10:1 with ±2% accuracy, so every shot cures the same — no soft spots, no wasted material.

Send Inquiry Now

Built for Small Batches

Handheld gun with foot-switch control and 1–30 g/s adjustable flow adapts to multi-product workshops, prototypes and frequent changeovers.

Send Inquiry Now

Stable Material Supply

15/30/55 L stainless tanks with stirring and visible level windows, plus automatic refill — material stays homogeneous from the first to the last shot.

Send Inquiry Now

Bubble-Free Option

The optional vacuum defoaming module pulls −98 kPa to remove micro-bubbles from raw material — ideal for high-insulation electronic components.

Send Inquiry Now

Heavy-Duty Construction

Thickened cold-rolled steel cabinet, all-stainless metering pumps and a three-colour alarm light — built for long, reliable service life.

Send Inquiry Now

Applications

Semi-automatic two-component potting equipment

Semi automatic two-part encapsulation equipment

LED Lighting Driver Potting

Small-batch potting for LED power drivers with multiple models. The handheld gun and foot-switch control adapt to frequent product changeovers without stopping the line.

3C electronics industry

Automotive Sensor Potting

Pressure, temperature and reversing sensors potted with high-viscosity silicone. Optional vacuum defoaming removes micro-bubbles for reliable sealing in harsh vehicle environments.

Auto parts industry

Home Appliance Control Boards

Small circuit boards for air conditioners, water heaters and washing machines. Precise 1:1–10:1 ratio control protects sensitive components from over-potting.

3C electronics industry

Miniature Transformers & Inductors

High-frequency miniature network transformers and small inductors. ±2% accurate mixing ratio avoids voids in tight windings; dynamic/static mixing to suit the compound.

3C electronics industry

Energy Storage Small Power Modules

Small energy-storage battery protection boards and miniature charging modules. Compact machine footprint fits workshops and pilot lines with limited floor space.

New energy & lithium battery industry

What mixing ratio can the HY-S55L handle?

The mixing ratio adjusts from 1:1 to 10:1 in software with ±2% accuracy, held by servo-driven metering pumps. One to four metering sets can be fitted, and dynamic or static mixing valves are available to suit the adhesive’s viscosity and pot life.

Which adhesives are compatible with this semi automatic potting machine?

Two-component epoxy, polyurethane and silicone with viscosities up to 500,000 cps. Gear, screw or piston metering pumps are matched to the material, and 15/30/55 L stainless tanks with stirring keep fillers evenly suspended from the first to the last shot.

Is vacuum defoaming included on the HY-S55L?

Vacuum defoaming is an optional module that pulls −98 kPa to remove micro-bubbles from the raw material before dispensing — recommended for high-insulation electronic components such as LED drivers and power modules. Polyurethane in particular traps bubbles easily, so the module pays for itself on PU jobs.

How fast can the HY-S55L dispense?

Dispensing speed adjusts from 1 to 30 g/s through a handheld gun with foot-switch control, so the operator can match flow to each workpiece. Automatic cleaning and a 0–300 s anti-curing timer protect the mixing valve between shots.

What utilities does the machine need?

AC 380 V power and 0.5–0.7 MPa compressed air, in a 0–40 ℃ working environment. The cabinet is thickened cold-rolled steel weighing about 350 kg, with an independent mixing-valve cabinet and a three-colour alarm light.

What is the lead time for the HY-S55L?

Standard machines ship in 30–45 days; customised configurations take 60–120 days depending on complexity. HY engineers support installation and commissioning on site or by video.