Semi-Automatic Two-Component Glue Filling Machine HY-S55L

Início › Produtos › Dispensing & Potting › Semi-Automatic Two-Component Glue Filling Machine HY-S55L

For small batches, prototypes and multi-product workshops, a full inline line is overkill — yet manual mixing is slow, inconsistent and wastes expensive two-component material. The HY-S55L semi automatic potting machine bridges that gap: servo-driven metering pumps mix epoxy, polyurethane or silicone at an adjustable 1:1–10:1 ratio with ±2% accuracy, then dispense at 1–30 g/s through a handheld gun with foot-switch control.

The operator positions the workpiece and triggers each shot while the machine handles ratio, flow and anti-curing automatically. Stainless-steel 15/30/55 L tanks with stirring and visible level windows keep material ready; the optional vacuum defoaming module removes micro-bubbles for high-insulation electronics.

Running on AC 380 V in a 350 kg cabinet, this semi automatic potting machine switches products by recipe recall — the cost-effective choice for LED drivers, automotive sensors, control boards, transformers and small power modules.

Especificação

Specifications can be customised to your workpiece and material.

Caraterísticas

• Precise ratio, every shot — servo-driven metering pumps hold the A:B ratio at 1:1–10:1 with ±2% accuracy, so every shot cures the same.
• Built for small batches — handheld gun with foot-switch control and 1–30 g/s adjustable flow adapts to multi-product workshops, prototypes and frequent changeovers.
• Dynamic or static mixing — mixing valve options match the adhesive’s viscosity and pot life.
• Stable material supply — 15/30/55 L stainless tanks with stirring and visible level windows, plus automatic refill.
• Automatic cleaning & anti-curing — auto-clean cycle with a 0–300 s adjustable anti-curing timer protects the mixing valve between shots.
• Full process monitoring — pressure, flow, level and stirring monitored continuously; the three-colour alarm light signals any anomaly.
• Bubble-free option — the optional vacuum defoaming module pulls −98 kPa to remove micro-bubbles for high-insulation electronics.
• Heavy-duty construction — thickened cold-rolled steel cabinet with all-stainless metering pumps, built for long service life.

Optional Configuration

Comparison

Typical property ranges from published material guides; check your compound’s TDS for exact figures.

Packaging & Delivery

The semi-automatic two-component glue filling machine HY-S55L is packed in a fumigation-free export wooden case with moisture protection, fixed for sea freight. Standard machines ship in 30–45 days; customised configurations in 60–120 days depending on complexity (final schedule in contract). HY engineers provide installation, commissioning and operator training on site or by video, with process parameters set against your own parts before handover. Warranty and after-sales terms follow the sales contract; remote troubleshooting is available for overseas customers, and every machine’s potting programs and calibration data are archived by HY for lifetime support.