Two-Component Automatic Glue Filling Machine HY-S400

Bubbles and inaccurate mixing ratios ruin electronic potting — causing rework, scrap and field failures. The HY-S400 meters, mixes and dispenses two-part epoxy, PU and silicone with ±2% ratio accuracy, while −98 kPa vacuum degassing removes trapped air for void-free encapsulation.

−98 kPa Vacuum | ±2% Mixing Ratio Accuracy | 400×400×100 mm Working Range

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Introdução ao produto

The HY-S400 is a two component potting machine built for electronics manufacturers who need precise, bubble-free encapsulation at production speed. It meters two-part epoxy, PU, silicone or AB glue at a 1:1–10:1 adjustable ratio with ±2% accuracy, then mixes and dispenses through a three-axis motion platform covering 400×400×100 mm at up to 500 mm/s.

A −98 kPa vacuum system degasses the material and the workpiece before and during dispensing, eliminating the voids and pinholes that cause insulation failure in power modules, sensors and LED drivers. Dynamic plus static mixing handles viscosities up to 500,000 cps, while automatic cleaning and a 0–300 s anti-curing timer keep the mixing head ready between cycles.

The Windows 10 PC control with touchscreen stores unlimited recipes for quick changeover and connects to MES for traceable production. Compared with our vacuum potting machine for high-vacuum applications, the HY-S400 is the cost-effective two component potting machine for atmospheric and assisted-vacuum encapsulation lines.

Especificação

Item	HY-S400
Model	HY-S400 (HY-S400-55L)
Machine type	Two-component automatic glue filling (potting) machine
Mixing ratio	1:1–10:1 adjustable
Mixing ratio accuracy	±2%
Dispensing accuracy	±3%
Metering pumps	Gear / screw / piston, independent A/B servo drives
Working range (X/Y/Z)	400 × 400 × 100 mm
Dispensing speed	0–500 mm/s
Dispensing rate	Customisable (depends on pump configuration)
Material tanks	15L / 30L / 55L optional, heating + stirring + degassing
Multi-head metering	1–4 sets (optional)
Compatible materials	Epoxy, PU, silicone, AB glue; viscosity up to 500,000 cps
Mixing method	Dynamic + static
Control system	Windows 10 PC + touchscreen, recipe storage, MES integration
Monitoring	Pressure, flow, weighing, liquid level, stirring; alarms on abnormal output
Power supply	AC 220V, 50Hz
Air supply	0.5–0.7 MPa

Specifications can be customised to your workpiece and material. Request Datasheet

Caraterísticas

Independent servo metering — separate servo drives meter A and B components with ±2% ratio accuracy.
Vacuum degassing — material preparation with vacuum degassing removes trapped air for bubble-free dispensing.
Thin-film defoaming agitator — keeps raw glue bubble-free before output, even with high-viscosity filled epoxy.
Three-axis motion platform — 400×400×100 mm working range at 0–500 mm/s for precise potting paths.
Dynamic + static mixing — handles epoxy, PU, silicone and AB glue up to 500,000 cps.
Automatic cleaning & anti-curing — 0–300 s adjustable timer prevents mixing-pipe blockage.
Full process monitoring — pressure, flow, weighing, level and stirring monitored with auto alarms.
Windows 10 PC control — touchscreen HMI, unlimited recipe storage, MES integration for traceable production.

Optional Configuration

Option	What it does
Metering pump customization	Gear, screw or plunger pump optional; two-stage metering matches different glue fluidity.
Material tank capacity adjustment	15L/30L/55L barrels with built-in stirring and thin-film defoaming; visual level gauge.
Multi-head dispensing expansion	1–4 sets of metering heads for synchronous multi-station potting.
Online monitoring system upgrade	Real-time pressure, flow and weighing monitoring; auto alarm on abnormal output.
Pipeline heating function	Heating module for low-temperature workshops; prevents glue crystallization and viscosity rise.
Conveyor & vacuum matching	Custom track conveyor for line docking; −98 kPa vacuum system eliminates bubbles.

Comparison

	Vacuum-assisted potting (HY-S400)	Atmospheric potting
Residual voids	Below 0.1%	Typically 2–5%
Complex geometries / undercuts	Fills reliably	Air traps likely
Insulation reliability	High — no void-related partial discharge	Voids can lower dielectric strength
Suitable parts	Power modules, sensors, LED drivers	Simple geometries, non-critical parts
Equipment cost	Higher	Lower

Typical property ranges from published material guides; check your compound’s TDS for exact figures.

Property	Epoxy	Polyurethane (PU)	Silicone
Cured hardness	Shore D 70–95 (rigid)	Shore A 30 – D 60 (flexible–semi-rigid)	Shore A 20–70 (elastomeric)
Continuous temperature	Up to 150–180°C	−40 to 120–130°C	−55 to 200°C
Adhesion	Excellent	Good–excellent on plastics	Moderate (primer recommended)
Thermal shock resistance	Fair (can crack)	Good	Excellent
Reworkability	Poor	Poor	Excellent (cuttable)
Relative cost	Medium	Low–medium	High
Typical automotive use	Power modules, coils needing structure	Sensors, connectors needing flex	High-temperature / high-vibration electronics
On the HY-S400	✔	✔ (vacuum recommended — PU traps bubbles easily)	✔

Packaging & Delivery

The HY-S400 is packed in a fumigation-free export wooden case with moisture protection, fixed for sea freight. Standard machines ship in 30–45 days; customised configurations in 60–120 days depending on complexity (final schedule in contract). HY engineers provide installation, commissioning and operator training on site or by video, with process parameters set against your own parts before handover. Warranty and after-sales terms follow the sales contract; remote troubleshooting is available for overseas customers, and every machine’s potting programs and calibration data are archived by HY for lifetime support.

Core Advantages

±2% Mixing Ratio Accuracy

Gear, screw or piston metering pumps deliver a 1:1–10:1 adjustable mixing ratio with ±2% accuracy, so every shot cures consistently.

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Bubble-Free Vacuum Potting

A −98 kPa vacuum system degasses the material and the workpiece before and during dispensing, eliminating voids that cause insulation failure.

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400×400×100 mm Working Range

Three-axis servo motion covers 400(X)×400(Y)×100(Z) mm at 0–500 mm/s for precise, repeatable potting paths on complex housings.

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Handles up to 500,000 cps

Dynamic plus static mixing processes epoxy, PU, silicone and AB glue up to 500,000 cps, including high-viscosity filled materials.

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Automatic Cleaning & Anti-Curing

Automatic cleaning with a 0–300 s anti-curing timer prevents mixing-pipe blockage and cuts maintenance downtime between batches.

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Smart Monitoring & MES Ready

Real-time pressure, flow, weighing, level and stirring monitoring with alarms; Windows 10 PC control stores recipes and integrates with MES.

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Aplicações

Automatic two-component vacuum dispensing equipment

Automotive two-part vacuum encapsulation equipment

New Energy Power Supply & Inverter — Fit for solar junction boxes, energy storage inverters and charging pile power modules. Vacuum potting protects against moisture and vibration.
New Energy & Lithium Battery Industry

Automotive Electronics — Used for automobile sensors, ignition coils, vehicle control modules and new energy battery BMS. High-seal potting meets automotive reliability standards.
Auto Parts Industry

LED Lighting Driver — Apply to LED street light, panel light and flood light drivers. Uniform glue encapsulation realizes heat dissipation and long service life.
Auto Parts Industry

Industrial PCB & Transformer — For high-frequency transformers, network transformers and industrial control PCB boards. ±2% accurate ratio ensures consistent insulation performance.
3C Electronics Industry

Sensor & Instrument Components — Suitable for pressure, temperature and liquid level sensors plus precision instrument circuit modules. Stable potting improves measurement reliability.
3C Electronics Industry

FAQ

HY two-component automatic potting machine brings intelligent manufacturing to your encapsulation process with advanced digital control capabilities. The WIN10/PLC+PC integrated system provides intuitive touchscreen operation, real-time parameter display and unlimited program storage for quick recipe switching. The system automatically records key production data including dispensing volume, mixing ratio and operating time for quality traceability and process optimization. Optional MES connectivity enables seamless integration with your factory management system, supporting data-driven production management. With features like automatic glue level detection, anti-curing timing and fault alarms, the machine operates intelligently with minimal operator intervention, reducing human error and improving overall production efficiency and consistency across your entire manufacturing operation.

What mixing ratio accuracy does the HY-S400 achieve?

The HY-S400 achieves ±2% mixing ratio accuracy and ±3% dispensing accuracy. Independent servo-driven metering pumps for the A and B components deliver a 1:1–10:1 adjustable mixing ratio, set directly in the software. Gear, screw or piston pumps are matched to your material, and pressure, flow and weighing monitoring with alarms keep every cycle stable.

What working range and speed does the HY-S400 offer?

The three-axis servo motion platform covers 400(X)×400(Y)×100(Z) mm at 0–500 mm/s, giving precise, repeatable potting paths for ECU housings, sensors and power modules. Larger custom strokes can be configured for bigger workpieces or multi-station fixtures — talk to HY engineers with your part drawing.

Which glues can the HY-S400 process?

The machine processes epoxy, polyurethane (PU), silicone and AB glue with viscosities up to 500,000 cps. Dynamic plus static mixing handles both low- and high-viscosity materials, and the metering pump type — gear, screw or piston — is selected to suit your adhesive. Tanks with heating and stirring keep the material fluid and consistent.

How does the HY-S400 prevent bubbles in the glue?

Material preparation is where bubbles are defeated: optional vacuum degassing tanks remove trapped air from the glue before it is dispensed, while heated tanks with continuous stirring prevent viscosity drift that causes uneven potting. A thin-film defoaming agitator keeps the raw glue bubble-free right up to the metering pump, even with high-viscosity materials.

What is the lead time for the HY-S400?

Standard machines ship in 30–45 days; customised configurations in 60–120 days depending on complexity — the final schedule is confirmed in the sales contract. Machines are packed in fumigation-free export wooden cases with moisture protection, fixed for sea freight, and HY engineers provide installation, commissioning and operator training on site or by video.